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PCB/FCP Plating Machine
Flexible Circuit Panel E-less Cu Via Filling Plating Machine for controlled copper plating, blind hole filling and through-hole filling applications.
The PCB/FCP Plating Machine is designed for full board copper plating, reverse pulse plating, FCP blind hole full filling and through hole full filling, with semi-automatic or manual loading and unloading together with adjustable plating solution flow control.
Flexible Circuit Panel E-less Cu Via Filling Plating Machine
The PCB/FCP Plating Machine is a specialised Surface Treatment Equipment solution developed for copper plating processes involving printed circuit boards and flexible circuit panels. The system supports controlled plating processes where copper deposition, hole filling and plating solution circulation are important to production consistency.
Designed as a Flexible Circuit Panel E-less Cu Via Filling Plating Machine, the equipment can support different copper plating requirements, including full board copper plating, reverse pulse processing, FCP blind hole full filling and through hole full filling.
- Full board copper plating
- Reverse pulse plating process
- FCP blind hole full filling
- Through hole full filling
- Semi-automatic loading and unloading
- Manual loading and unloading configuration
Copper Plating Process Capability
The PCB/FCP copper plating system provides a practical configuration for circuit panel plating applications where controlled copper deposition and consistent plating solution movement are required. Depending on the production arrangement, operators can use either semi-automatic or manual loading and unloading operations.
- PCB and FCP copper plating applications
- E-less Cu via filling process
- Full board copper deposition
- Reverse pulse capability
- Blind hole copper filling
- Through-hole copper filling
- Semi-automatic operation
- Manual loading and unloading
Cu Plating Tank with Adjustable Flow Control
The Cu plating tank is equipped with spray nozzles to support plating solution circulation throughout the copper plating process. Proper solution movement can contribute to more controlled operating conditions across the plating area.
The flow rate can be regulated through the permanent magnet pump by varying the operating frequency in Hertz (Hz). This allows the circulation flow to be adjusted according to the required PCB/FCP plating process conditions.
- Cu plating tank with integrated spray nozzles
- Permanent magnet pump circulation system
- Adjustable plating solution flow rate
- Flow regulation through frequency adjustment
- Frequency controlled in Hertz (Hz)
- Suitable for controlled PCB/FCP copper plating processes
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Enhance Your PCB/FCP Copper Plating Process
Explore a PCB/FCP plating machine solution designed for copper plating, via filling, blind hole filling and controlled plating solution circulation. Contact us to discuss your surface treatment equipment requirements.
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